Deposition apparatus, method thereof and method for forming quantum-dot layer using the same

摘要

A deposition apparatus includes a first nozzle configured to spray a first deposition material toward a substrate and a second nozzle configured to spray a second deposition material, a first deposition source configured to supply the first deposition material to the first nozzle and a second deposition source configured to supply the second deposition material to the second nozzle. The deposition apparatus further includes a barrier member disposed between the first nozzle and the second nozzle and is configured to block the first deposition material evaporated through the first nozzle from being mixed with the second deposition material evaporated through the second nozzle and a vacuum chamber configured to surround the first and second nozzles, the first and second deposition sources and the barrier member.

主权项

1. A deposition apparatus comprising:
a first nozzle configured to spray a first deposition material toward a substrate; a second nozzle configured to spray a second deposition material; a first deposition source configured to supply the first deposition material to the first nozzle; a second deposition source configured to supply the second deposition material to the second nozzle; a barrier member disposed between the first nozzle and the second nozzle and configured to block the first deposition material evaporated through the first nozzle from being mixed with the second deposition material evaporated through the second nozzle; a transporting device configured to transport the substrate in a first direction above the first nozzle or in a second direction above the second nozzle; and a vacuum chamber configured to surround the first and second nozzles, the first and second deposition sources, the barrier member, the transporting device, and the substrate, wherein the barrier member partitions the vacuum chamber into a first section including the first nozzle and a second section including the second nozzle, and wherein the transporting device is further configured to position the substrate either entirely within the first section of the vacuum chamber or entirely within the second section of the vacuum chamber.