PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To achieve improvement in connection reliability and prevention of a connection failure against warpage of the printed wiring board, and to achieve reliable connection to electronic components in a high-density wiring pattern and prevention of a short circuit failure.SOLUTION: A printed wiring board in an embodiment includes: a resin insulation layer 11 having a first surface 11a and a second surface 11b; a first conductor layer 12 embedded on the first surface 11a side and including a plurality of wiring lines 12a and connecting parts 12b where electronic components are to be electrically connected; a second conductor layer 14 formed as protruding from the second surface 11b; a via conductor 15 electrically connecting the first conductor layer 12 and the second conductor layer 14; and a solder resist layer 16 formed above the first surface 11a of the resin insulation layer 11 and on the first conductor layer 12, and having an opening 16a to expose each connecting part 12b. A metal post 13 having a width larger than the width of the connecting part 12b is laid on the connecting part 12b exposed through the opening 16a. The connecting parts 12b are juxtaposed on every other line of the adjoining wiring lines 12a.SELECTED DRAWING: Figure 1