TEMPORARILY FIXING RESIN COMPOSITION, TEMPORARILY FIXING RESIN FILM, TEMPORARILY FIXING RESIN FILM SHEET, AND SEMICONDUCTOR WAFER PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide: a temporarily fixing resin composition which is applicable to a low-temperature and short-time hardening, has superior low-temperature adhesion and sufficient heat resistance, allows a semiconductor wafer to be fixed to a support adequately, and enables the formation of a film-shaped temporarily fixing material allowing the semiconductor wafer after processing to be readily separated from the support and the temporarily fixing material; a temporarily fixing resin film and a temporarily fixing resin film sheet which are arranged by use of such a temporarily fixing resin composition; and a semiconductor wafer processing method using such a temporarily fixing resin film.SOLUTION: A temporarily fixing resin composition is for forming a film-shaped temporarily fixing material used in a semiconductor wafer processing method including a temporarily fixing step for temporarily fixing a semiconductor wafer to a support through the film-shaped temporarily fixing material, a processing step for processing the semiconductor wafer temporarily fixed to the support, and a separation step for separating the processed semiconductor wafer from the support and the film-shaped temporarily fixing material. The temporarily fixing resin composition comprises: (A) a thermoplastic resin; (B) a thermosetting resin; (C) a (meth)acryl monomer; and (D) a radical polymerization initiator.SELECTED DRAWING: None