ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To simply transfer a thin silicon structure on a circuit board without constraints in structure size and without performing a special treatment of material.SOLUTION: An electronic device 10 roughly comprises: a quadrangular frame-shaped substrate 11 in which an opening 12 is formed by hollowing the central part; and a silicon structure 13 which is formed in a manner such that most part is bridged over the opening 12 of the substrate 11 and only a part of each of both ends is connected on the substrate 11, and which has a flat rectangular parallelepiped shape thinner than the substrate 11. A manufacturing method of an electronic device comprises the steps of: forming a lower electrode 14 on the silicon structure 13 via a thin oxide film; laminating a piezoelectric thin film 15 which is an example of a functional element for achieving a predetermined function and an upper electrode 16 on the lower electrode 14; further forming an electrode pad 17a and an electrode pad 17b; and separating the silicon structure 13 from the substrate 11 to be bonded/transferred to a flexible circuit board 31 to configure a new electronic device 30.SELECTED DRAWING: Figure 1