| 摘要 |
PROBLEM TO BE SOLVED: To improve the productivity of chips.SOLUTION: Disclosed is a burr removing method in which burrs (16) formed on side surfaces of chips (15) are removed, which are obtained by dividing a package substrate (W) formed by partitioning a plurality of LED devices (12) by scheduled division lines (11), using a cutting blade (14). This method includes: a chip charging step for charging chips into a cylindrical drum (3) capable of housing chips therein; and a removal step for removing the burrs of the chips by utilizing a centrifugal force generated in the chips by rotating the drum housing the chips therein at a high speed.SELECTED DRAWING: Figure 2 |
