发明名称 |
Semiconductor device with an array of lamellas and a micro-electro-mechanical resonator |
摘要 |
A semiconductor device includes a silicon substrate layer with a decoupling region. The decoupling region of the silicon substrate layer comprises an array of lamellas laterally spaced apart from each other by cavities. Each lamella of the array of lamellas comprises at least 20% silicon dioxide. |
申请公布号 |
US9293529(B2) |
申请公布日期 |
2016.03.22 |
申请号 |
US201313945113 |
申请日期 |
2013.07.18 |
申请人 |
Infineon Technologies Dresden GmbH |
发明人 |
Kautzsch Thoralf |
分类号 |
H01L29/00;H01L29/06;H01L21/762;H03H3/007;H03H9/24;H03H9/02 |
主分类号 |
H01L29/00 |
代理机构 |
Schiff Hardin LLP |
代理人 |
Schiff Hardin LLP |
主权项 |
1. A micro-electro-mechanical resonator comprising:
a resonator structure, wherein the resonator structure comprises at least one resonator area and at least one anchor area, wherein the resonator area is arranged next to an electrode for stimulating an oscillation of the resonator structure, wherein an array of lamellas with at least one row of lamellas connects the anchor area laterally to a silicon substrate layer surrounding the resonator structure,wherein the resonator structure and the array of lamellas are arranged above a common lateral cavity so that the resonator structure is connected to neighboring silicon solely through the array of lamellas connected to the anchor region. |
地址 |
Dresden DE |