发明名称 Trench-based power semiconductor devices with increased breakdown voltage characteristics
摘要 Exemplary power semiconductor devices with features providing increased breakdown voltage and other benefits are disclosed.
申请公布号 US9293526(B2) 申请公布日期 2016.03.22
申请号 US201213667319 申请日期 2012.11.02
申请人 Fairchild Semiconductor Corporation 发明人 Yedinak Joseph A.;Challa Ashok;Probst Dean
分类号 H01L29/66;H01L29/06;H01L29/78;H01L29/872;H01L29/739;H01L29/10;H01L29/40;H01L29/417;H01L29/423 主分类号 H01L29/66
代理机构 代理人
主权项 1. A semiconductor device comprising: a gate runner disposed above a semiconductor region; a trench disposed in the semiconductor region and having a first portion disposed on a first side of the gate runner and a second portion disposed on a second side of the gate runner; a shield dielectric disposed in the semiconductor region and lining a sidewall of the trench; a shield electrode disposed in the semiconductor region and having a first portion disposed in the first portion of the trench, the shield electrode having a second portion disposed in the second portion of the trench; a gate dielectric disposed in the semiconductor region and lining an upper sidewall of the second portion of the trench; a gate electrode disposed in the semiconductor region and disposed in the second portion of the trench and insulated from the second portion of the shield electrode; and a shield runner made of a metal and disposed above the semiconductor region and having a portion contacting a top surface of the first portion of the shield electrode, the top surface of the first portion of the shield electrode being at or below a top surface of the semiconductor region.
地址 San Jose CA US