发明名称 Laser processing method
摘要 A laser processing method of applying a pulsed laser beam having a repetition frequency of 20 kHz or more to a workpiece to thereby process the workpiece. The relation between the wavelength of the pulsed laser beam and the pulse width generating no cracks is determined by experiment on the basis of the absorption edge of the workpiece, thereby setting the processing conditions. The relation between various set values for the wavelength and the limits of the pulse width is plotted to prepare a graph having a vertical axis representing the wavelength and a horizontal axis representing the pulse width. The pulsed laser beam is applied in the region below a curve obtained by connecting the limits of the pulse width at the various set values for the wavelength.
申请公布号 US9289851(B2) 申请公布日期 2016.03.22
申请号 US201313937924 申请日期 2013.07.09
申请人 Disco Corporation 发明人 Morikazu Hiroshi
分类号 B23K26/359;B23K26/364;H01L21/301;B23K26/02;H01L21/30;B23K26/067;B23K26/08 主分类号 B23K26/359
代理机构 Greer Burns & Crain, Ltd. 代理人 Greer Burns & Crain, Ltd.
主权项 1. A laser processing method of applying a pulsed laser beam having a repetition frequency of 20 kHz or more to a workpiece to thereby process said workpiece, said laser processing method comprising the steps of: setting the pulse width of said pulsed laser beam to 10 ps or less in the case that the wavelength of said pulsed laser beam is equal to the absorption edge of said workpiece; setting the pulse width of said pulsed laser beam to 100 ps or less in the case that the wavelength of said pulsed laser beam is equal to 9/10 of the absorption edge of said workpiece; setting the pulse width of said pulsed laser beam to 1 ns or less in the case that the wavelength of said pulsed laser beam is equal to 8/10 of the absorption edge of said workpiece; setting the pulse width of said pulsed laser beam to 10 ns or less in the case that the wavelength of said pulsed laser beam is equal to 7/10 of the absorption edge of said workpiece; setting the pulse width of said pulsed laser beam to 100 ns or less in the case that the wavelength of said pulsed laser beam is equal to 6/10 of the absorption edge of said workpiece; setting the pulse width of said pulsed laser beam to 100 fs or less in the case that the wavelength of said pulsed laser beam is equal to a value two times the absorption edge of said workpiece; and setting the pulse width of said pulsed laser beam to 10 fs or less in the case that the wavelength of said pulsed laser beam is equal to a value four times the absorption edge of said workpiece; wherein the relation between the various set values for the wavelength of said pulsed laser beam and the various set values for the pulse width of said pulsed laser beam is plotted to prepare a graph having a vertical axis representing the wavelength and a horizontal axis representing the pulse width, and said pulsed laser beam is applied in the region below a curve obtained by connecting the limits of the pulse width at the various set values for the wavelength.
地址 Tokyo JP