PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To improve insulation properties at a connection part of bot surfaces of a printed wiring board on which a pattern can be formed on one surface at a fine pitch and secure sufficient amount of a joint material.SOLUTION: A printed wiring board comprises: a wiring conductor layer 21 having a first face F1 and a second face F2; a conductor post 25 formed on the second face F2 of the wiring conductor layer 21; and a resin insulation layer 30 in which the wiring conductor layer 21 is embedded to expose the first face F1 on the first surface SF1 and covers a lateral face of the conductor post 25. The first face F1 of the wiring conductor layer 21 sinks deeper than the first surface SF1 of the resin insulation layer 30. An end face 25a of the conductor post 25 is exposed on the second surface SF2 side of the resin insulation layer 30 and sinks deeper than the second surface SF2. A distance from the second surface SF2 of the resin insulation layer 30 to the end face 25a of the conductor post 25 is larger than a distance from the first surface SF1 of the resin insulation layer 30 to the first face F1 of the wiring conductor layer 21.SELECTED DRAWING: Figure 1