发明名称 |
Laser repairing apparatus and laser repairing method for substrate |
摘要 |
According to embodiments of the present invention, there are disclosed a laser repairing apparatus and a laser repairing method for a substrate. The laser repairing apparatus comprises: a laser emitter; and a light transmission sheet with a light-shielding pattern, wherein a laser emitted by the laser emitter is used to cut a superfluous remainder of an electrode on the substrate, the light transmission sheet is located between the laser emitter and the substrate, and as compared with a pattern of the electrode on the substrate, the light-shielding pattern on the light transmission sheet has the same shape and a size at a predetermined ratio. |
申请公布号 |
US9291839(B2) |
申请公布日期 |
2016.03.22 |
申请号 |
US201213699567 |
申请日期 |
2012.08.15 |
申请人 |
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
Zhao Haisheng;Bai Guoxiao;Yang Weisong |
分类号 |
B23K26/14;G02F1/13;B23K26/38 |
主分类号 |
B23K26/14 |
代理机构 |
Ladas & Parry LLP |
代理人 |
Ladas & Parry LLP |
主权项 |
1. A laser repairing apparatus for a substrate, comprising:
a laser emitter; and a light transmission sheet with a light-shielding pattern, wherein a laser emitted by the laser emitter is used to cut a superfluous remainder of an electrode on the substrate, the light transmission sheet is located between the laser emitter and the substrate, and as compared with a pattern of the electrode to be retained on the substrate, the light-shielding pattern on the light transmission sheet has the same shape and a size at a predetermined ratio as the entire pattern of the electrode to be retained. |
地址 |
Beijing CN |