| 摘要 |
To stably perform cutting process even on a workpiece formed from a brittle material, in a ductile mode with high precision, without causing cracking and/or breaking in the workpiece. A dicing device (10) which performs cutting process on a workpiece (W) includes: a dicing blade (26) that is formed into a discoid shape from a diamond sintered body (80) formed by sintering diamond abrasive grains, and contains 80 % or more of the diamond abrasive grains; a spindle (rotating mechanism) (28) configured to rotate the dicing blade (26); and a movement mechanism configured to move the workpiece (W) relatively to the dicing blade (26) while forming a constant cut depth on the workpiece (W) by the dicing blade (26). |
