发明名称 圧電振動デバイス
摘要 PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device usable in a variety of applications such as VCXO, SPXO, TCXO, OCXO and on-vehicle X'tal.SOLUTION: A vibration-side first bonding pattern 251 and a vibration-side second bonding pattern 252 which are physical vapor deposited are formed on both main surfaces 211, 212 of a crystal diaphragm 2. A sealing-side first bonding pattern 321 which is physical vapor deposited is formed on a first seal member 3, and a sealing-side second joining pattern 421 which is physical vapor deposited is formed on a second seal member 4. The sealing-side first bonding pattern 321 and the vibration-side first bonding pattern 251 are diffusion-bonded, and the sealing-side second bonding pattern 421 and the vibration-side second bonding pattern 252 are diffusion-bonded. In the second seal member 4, connection terminals 431, 432 to be diffusion-bonded to a function part 7, where external electrode terminals 721, 722 directly bonded to a circuit board 61 are formed, are formed, the connection terminals being physical vapor deposited.
申请公布号 JP5888347(B2) 申请公布日期 2016.03.22
申请号 JP20140008801 申请日期 2014.01.21
申请人 株式会社大真空 发明人 飯塚 実;古城 琢也
分类号 H03H9/02;H01L23/02;H03B5/32 主分类号 H03H9/02
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