Heat sink for processor

摘要

A heat sink for a processor includes: a main heat exchange zone that bears in contact with a processor; at least one peripheral heat exchange zone that bears in contact with a cooling source, and at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid.

主权项

1. An electronic board comprising:
a support; a processor; a cooling source; a heat sink including
a main heat exchange zone bearing in contact with the processor;at least one peripheral heat exchange zone in thermal contact with the cooling source,at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid, wherein the processor is located between the heat sink and the support, the main heat exchange zone bearing the processor, the peripheral heat exchange zone being thermally connected to the cooling source, and wherein the cooling source is a cold plate extending substantially parallel to the support, the electronic board further comprising electronic components other than the processor, the electronic components being fixed onto the support, the cold plate covering all electronic components fixed onto the support for which the height is less than the sum of: the distance between the cold plate and the support; and the thickness of the cold plate.