METHOD FOR FABRICATING WAFER STRUCTURE HAVING LATERAL JUNCTION

摘要

The present invention relates to a method for fabricating a wafer structure having a lateral junction to improve process reproducibility. The method includes a step of forming the wafer structure on a first substrate; a step of cutting the wafer structure and forming a plate-shaped vertical wafer structure; and a step of transferring the vertical wafer structure to the plane of a second substrate. In the transfer step, the vertical wafer structure is transferred to a lateral wafer structure on the plane of the second substrate. The method can improve mechanical stability and reduce the generation of errors in processes.