| 摘要 |
The present invention relates to a conductive film forming composition for forming a conductive film showing excellent adhesion with a substrate and low resistance. The present invention also relates to a conductive film, a preparing method for the same, a plating film, and an electronic device. The conductive film forming composition includes: (A) at least one of the metal salt and metal particles including at least one type of metal selected from a group including Ni, Pd, Pt, Cu, Ag, and Au; and (B) a metaloxane compound. The composition is used to form the conductive film on the substrate, execute a heating operation in an atmosphere or non-oxidizing atmosphere under the temperature of 250°C, form a conductive film on the substrate, and prepare a wiring board. The composition can also be used to form the conductive film on a transparent substrate (22) with first and second sensing electrodes (23, 24) and form an outgoing wire (31) by heating the conductive film in order to prepare the touch panel (21). |
