PROCESSING MODULE, PROCESSING APPARATUS AND PROCESSING METHOD

摘要

A subject of the present invention is to improve polishing precision on a polished surface of a processing object. An upper processing module (300A) relatively moves a wafer (W) and a pad (502) while the pad (502) of a smaller diameter than the wafer (W) touches the wafer (W) so as to perform a polishing process. The upper processing module (300A) comprises: a state detecting unit (910) configured to detect a state of a polished surface of the wafer (W) before or during the processing process; and a control unit (920) configured to control a polishing condition in a part of the polished surface of the wafer (W) in accordance with the state of the polished surface detected by the state detecting unit (910).