| 摘要 |
A substrate processing device comprises: a projection optical system (PL) which forms an intermediate image by imaging a first projection beam (EL2a) from a mask (M) and forms a projection image by reimaging onto a substrate (P) a second projection beam (EL2b) from an intermediate image surface (P7) on which the intermediate image is formed; and a light intensity reduction unit for reducing the light intensity of leak light generated from the first projection beam (EL2a) and projected onto the substrate (P). The projection optical system (PL) includes a partial optical system (61) for imaging the first projection beam (EL2a) from the mask (M) to project the image onto the intermediate image surface (P7); and a reflection optical system (62) for introducing the first projection beam (EL2a) projected from the partial optical system (61) to the intermediate image surface (P7) while introducing the second projection beam (EL2b) from the intermediate image surface (P7) into the partial optical system (61). The partial optical system (61) reimages the second projection beam (EL2b) from the intermediate image surface (P7) to form the projection image onto the substrate (P). |
