| 发明名称 |
METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE |
| 摘要 |
A method for fabricating an array substrate, an array substrate and a display device are provided. The method for fabricating the array substrate includes: forming a spacer layer on the array substrate, the spacer layer is disposed under a planarized layer and corresponds to a location of a via hole in the planarized layer, wherein the planarized layer is formed of a hot melt material. |
| 申请公布号 |
US2016079278(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201314352581 |
申请日期 |
2013.03.25 |
| 申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
WEI Xiaodan;ZHANG Xingqiang;LU Zhong;JANG Dongkoog |
| 分类号 |
H01L27/12;H01L29/66;H01L29/786 |
主分类号 |
H01L27/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating an array substrate, the array substrate comprises a planarized layer provided with a via hole, and the method comprises:
forming a spacer layer on the array substrate, the spacer layer is disposed under the planarized layer of the array substrate and corresponds to a location of the via hole in the planarized layer, wherein the planarized layer is formed of a hot melt material. |
| 地址 |
Beijing CN |
