| 发明名称 |
METHOD OF PROCESSING A SEMICONDUCTOR DEVICE AND CHIP PACKAGE |
| 摘要 |
In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia. |
| 申请公布号 |
US2016079087(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414488334 |
申请日期 |
2014.09.17 |
| 申请人 |
Infineon Technologies AG |
发明人 |
YEDURU SRINIVASA REDDY;HIRSCHLER JOACHIM;WIEDENHOFER HARALD;KLEINBICHLER FRANZ |
| 分类号 |
H01L21/3213;H01L29/41 |
主分类号 |
H01L21/3213 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A method of processing a semiconductor device, the method comprising:
providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and of the polymer layer to a plasma comprising ammonia. |
| 地址 |
Neubiberg DE |
