LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

A light emitting diode device and a manufacturing method therefor. The light emitting diode device (200) comprises: an LED chip (210) which has an upper surface (210a) and a lower surface (210b) which are opposite and a side wall (210c) which connects the upper and lower surfaces, wherein the lower surface is provided with a first electrode (212) and a second electrode (214), and there is a gap between the first electrode and the second electrode for achieving electrical isolation between the two electrodes; an encapsulating material layer (220) which covers the upper surface of the LED chip and is used for protecting and supporting the LED chip; an insulating layer (230) which fills the gap and extends to the first electrode and the second electrode to cover part of the surface thereof close to the gap, and is thicker than the first and second electrodes; and a solder electrode layer (240) which covers the first and second electrodes of the LED chip and by which connection is performed when the light emitting diode device is mounted on a circuit board. The light emitting diode device can be directly mounted on a circuit board by heating for use, without adopting a reflow soldering device.