| 主权项 |
1. An electronic-component mounting apparatus for mounting chips to a substrate, the apparatus comprising:
a sectionalized mounting stage divided into a heating section and a non-heating section, the heating section being for heating a substrate fixed to a front surface of the heating section, the non-heating section not heating the substrate suctioned to a front surface of the non-heating section; a full heating mounting stage for heating the substrate as a whole that is fixed to a front surface of the full heating mounting stage; and a paste application block configured to apply a non-conductive paste at positions on the substrate at which the electronic components are to be mounted, wherein after the non-conductive paste has been applied at the positions on the substrate at which the electronic components are to be mounted, only a portion of the substrate that is fixed to the heating section of the sectionalized mounting stage is heated, the electronic components are mounted to the positions in the heated portion, the substrate as a whole is heated on the full heating mounting stage, and the electronic components are mounted to the positions in a remaining portion. |
