PLATE-LIKE MEMBER DIVIDING DEVICE AND PLATE-LIKE MEMBER DIVIDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plate-like member dividing device and method that can accurately adjust the thicknesses of divided plate-like member pieces even when the size of the plate-like member is increased.SOLUTION: A plate-like member dividing device 10 has: first supporting means 20 for supporting one surface of a wafer WF as a plate-like member; reformed layer forming means 30 for forming a reformed layer 11 along one surface or the other surface of the wafer WF so as to make the wafer WF fragile; second support means 40 for supporting the other surface of the wafer WF; and dividing means 50 for relatively moving the first support means 20 and the second support means 40 and dividing the wafer WF into plural pieces along the reformed layer 11. A plate-like member dividing method comprises: a reformed layer forming step of forming the reformed layer 11 along one surface or the other surface of the wafer WF so as to make the wafer WF fragile; and a dividing step of dividing the plate-like member into plural pieces along the reformed layer 11.SELECTED DRAWING: Figure 1