| 摘要 |
The present technology relates to a solid-state imaging element that is configured such that the manufacturing cost of the solid-state imaging element can be reduced, and also relates to an electronic device. A first substrate, which has a pixel circuit including a pixel array unit, and a second substrate, which has a first signal processing circuit and a second signal processing circuit which are arranged side by side across a scribe region, are layered on each other. The second substrate is provided with: a first moisture-proof ring that surrounds at least part of the periphery of the first signal processing circuit; a second moisture-proof ring that surrounds at least part of the periphery of the second signal processing circuit; a third moisture-proof ring that is on a different layer from that of the first moisture-proof ring and second moisture-proof ring and surrounds at least part of the periphery of the second substrate; and moisture-proof barrier parts that separate a first region, which is located between the first moisture-proof ring and second moisture-proof ring, and a second region, which is at least partially surrounded by the third moisture-proof ring, from each other. The present technology can be applied, for example, to a solid-state imaging element such as a CMOS image sensor. |
