| 摘要 |
This metal composition (105) is provided between a first bonding object (101) and a second bonding object (102). This metal composition (105) contains a metal component (110) and a flux (108). The metal component (110) is composed of a first metal powder (106) that is formed of an Sn-based metal and a second metal powder (107) that is formed of a Cu-based metal having a higher melting point than the Sn-based metal. The flux (108) contains rosin, a solvent, a thixotropy-imparting agent, an activator and the like. If the metal composition (105) is heated and the temperature of the metal composition (105) reaches a temperature that is not less than the melting point of the first metal powder (106), the first metal powder (106) melts. The molten Sn and a CuNi alloy powder form an intermetallic compound phase (109), which is formed of a CuNiSn alloy, by a TLP reaction. |
