发明名称 Liquid Cooled Metal Core Printed Circuit Board
摘要 The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.
申请公布号 US2016081178(A1) 申请公布日期 2016.03.17
申请号 US201514854402 申请日期 2015.09.15
申请人 D'Onofrio Nicholas Michael 发明人 D'Onofrio Nicholas Michael
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. A direct liquid cooled metal core printed circuit board system comprising: a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component may be coupled to a base plate of a metal core printed circuit board such that a cavity forms between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board; and a first fastening mechanism, wherein the first fastening mechanism may couple the liquid cavity creating component to the base plate of a metal core printed circuit board.
地址 Denver CO US