发明名称 |
SILVER-COATED FLAKE TYPE COPPER POWDER AND PRODUCTION METHOD OF THE SAME, AND CONDUCTIVE PASTE USING THE SILVER-COATED FLAKE TYPE COPPER POWDER |
摘要 |
PROBLEM TO BE SOLVED: To provide a silver-coated flake type copper powder that can maintain conductivity even in a paste with a low filler content, a production method of the silver-coated flake type copper powder, and a conductive paste using the silver-coated flake type copper powder.SOLUTION: The silver-coated flake type copper powder comprises silver-coated flake type copper powder particles having silver on at least surfaces thereof and subjected to a flattening treatment. The silver-coated flake type copper powder particles have a circularity coefficient of 0.3 or more and 0.6 or less by the measurement of a scanning electron microscope image, and have an X-ray particle diameter of 10 nm or more and 30 nm or less on an Ag (111) plane and 30 nm or more and 58 nm or less on a Cu (111) plane.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016035098(A) |
申请公布日期 |
2016.03.17 |
申请号 |
JP20150065178 |
申请日期 |
2015.03.26 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
KANESHIRO MASAKI;INOUE KENICHI;SUGIYAMA AKIO;MOTOMURA KOICHI |
分类号 |
B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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