| 发明名称 |
Heat Dissipation System for Optical Module |
| 摘要 |
A heat dissipation system for an optical module, related to communication fittings technologies, is provided to improve heat dissipation efficiency of the optical module. The heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing. A first heat dissipation apparatus is fixedly disposed on the circuit card. A heat dissipation window is provided in an area that is above the laser and on the housing of the optical module. The first heat dissipation apparatus performs heat dissipation on the heat dissipation window. |
| 申请公布号 |
US2016079729(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514948558 |
申请日期 |
2015.11.23 |
| 申请人 |
Huawei Technologies Co., Ltd. |
发明人 |
Huang Shuliang;Hao Mingliang;Liu Zaomeng |
| 分类号 |
H01S5/024;H05K1/02;H01S5/022;H01L41/09;H01L41/08 |
主分类号 |
H01S5/024 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat dissipation system for an optical module, comprising a circuit card on which at least one optical module is mounted, wherein the optical module comprises a housing and a laser disposed inside the housing, wherein a first heat dissipation apparatus is fixedly disposed on the circuit card, wherein a heat dissipation window is provided in an area that is above the laser and on the housing of the optical module, and wherein the first heat dissipation apparatus performs heat dissipation on the heat dissipation window. |
| 地址 |
Shenzhen CN |
