ADHESION LAYER FOR INTERCONNECT STRUCTURE

摘要

Alternative methods of fabricating an interconnect structure having an adhesion layer, wherein the surfaces of the adhesion layer may be altered to correspond to the materials that are adhered to that surface.

主权项

1. A method of forming an interconnect structure, the method comprising:
forming at least one opening into an interconnect dielectric material; forming a metal diffusion barrier liner on the interconnect dielectric material, wherein at least a portion of the metal diffusion barrier liner is inside of at least one opening, and wherein the metal diffusion barrier liner comprises a second metal; forming an adhesion layer on the metal diffusion barrier liner, wherein the adhesion barrier has a sufficiently similar lattice structure as the metal diffusion barrier liner, wherein the adhesion layer comprises a first metal, and wherein the first metal is different from the second metal; modifying the lattice structure on at least an exposed surface of the adhesion layer to a lattice structure having a different orientation; forming a conductive material on the adhesion layer, wherein the conductive material has the same lattice structure of the modified surface of the adhesion layer; and removing the conductive material, the adhesion layer and the metal diffusion barrier liner that are located outside of the at least one opening.