PERFORATION OF FILMS FOR SEPARATION

摘要

A method for separation of semiconductor device cell units from fabricated large-area cell units, together with a corresponding tile unit structure, are provided in which the tile unit is cut along cell unit boundaries while leaving intact a set of specified tab sections distributed along the cell unit boundaries. The tile unit may be a multi-layer composite of a semiconductor layer with a conductive metallic base supported upon a polymer layer and adhered thereto by an adhesive film, wherein tab sections are cut completely through the semiconductor layer and its metallic base from above and may also be cut partially through the polymer layer from below, leaving at least a portion of the polymer layer in place at tab sections. Tile units can be handled such that component cell units are held together by the tab sections, until a physical final separation of selected cell units.

主权项

1. A method for separation of semiconductor device cell units from fabricated large-area tile units, comprising:
cutting a tile unit along cell unit boundaries while leaving partially intact a set of specified tab sections distributed along the cell unit boundaries; handling the tile unit for at least one manufacturing process operation such that individual cell units remain held together by the tab sections as parts of a single tile unit; and physically detaching at least one selected cell unit from the tile unit by disconnecting all tab sections that are along the boundary of that selected cell unit.