| 发明名称 |
INTEGRATED FAN-OUT PILLAR PROBE SYSTEM |
| 摘要 |
Disclosed herein is a method of probe testing dies, the method comprising loading a wafer having a first die and a second die into a prober and bringing probes of the prober into contact with first contact pads of the first die according to first probe parameters. A first probe contact test of first values of the contact between the probes and the first contact pads is performed, and a die test of the first die is performed after performing the probe contact test. Results of the die test and results of the probe contact test are saved and second probe parameters are automatically generated based on at least the results of the first probe contact test. |
| 申请公布号 |
US2016077147(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414488852 |
申请日期 |
2014.09.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wang Mill-Jer;Peng Ching-Nen;Lin Hung-Chih;Chen Hao;Lee Mincent;Tien Chen-Hung;How Chang Chia |
| 分类号 |
G01R31/26;G01R1/067;G01R31/28 |
主分类号 |
G01R31/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
loading a wafer having a first die and a second die into a prober; bringing probes of the prober into contact with first contact pads of the first die according to first probe parameters; performing a first probe contact test of first values of the contact between the probes and the first contact pads; performing a die test of the first die after the performing the probe contact test; saving results of the die test and results of the probe contact test; and automatically generating second probe parameters based on at least the results of the first probe contact test. |
| 地址 |
Hsin-Chu TW |
