| 发明名称 |
THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE |
| 摘要 |
Provided are a thermosetting resin composition with which a semiconductor device having a high connection reliability can be provided while securing availability of member materials by reducing a difference in thermal-responsive behavior between a semiconductor element and an adherend, and a method for producing a semiconductor device using the thermosetting resin composition. The present invention provides a thermosetting resin composition for producing a semiconductor device, the thermosetting resin composition comprising: an epoxy resin; and a novolak-type phenol resin having a hydroxyl equivalent of 200 g/eq or more. |
| 申请公布号 |
US2016075871(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414784892 |
申请日期 |
2014.04.11 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Morita Kosuke;Takamoto Naohide;Hanazono Hiroyuki;Fukui Akihiro |
| 分类号 |
C08L61/06;H01L23/00;H01L23/29;H01L21/56 |
主分类号 |
C08L61/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermosetting resin composition for producing a semiconductor device, the thermosetting resin composition comprising:
an epoxy resin; and a novolak-type phenol resin having a hydroxyl equivalent of 200 g/eq or more. |
| 地址 |
Ibaraki-shi, Osaka JP |
