| 发明名称 |
FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, FILM THICKNESS SIGNAL PROCESSING METHOD, AND POLISHING METHOD |
| 摘要 |
The present invention improves the accuracy of film thickness detection. A film thickness signal processing apparatus 230 is provided with a receiving unit 232 for receiving film thickness data output from an eddy-current sensor 210 for detecting the film thickness of a polishing object 102 along a surface to be polished thereof; an identifying unit 236 for identifying the effective range of the film thickness data on the basis of the film thickness data received by the receiving unit 232; and a correcting unit 238 for correcting the film thickness data within the effective range identified by the identifying unit 236. |
| 申请公布号 |
US2016074987(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514832618 |
申请日期 |
2015.08.21 |
| 申请人 |
Ebara Corporation |
发明人 |
TAKAHASHI Taro;NAKAO Hidetaka;NAKAMURA Akira |
| 分类号 |
B24B37/005;B24B49/00;H01L21/306;H01L21/66;H01L21/67;H01L21/683 |
主分类号 |
B24B37/005 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A film thickness signal processing apparatus comprising:
a receiving unit for receiving film thickness data output from a film thickness sensor for detecting the film thickness of a polishing object along a surface to be polished thereof; an identifying unit for identifying an effective range of the film thickness data on the basis of the film thickness data received by the receiving unit; and a correcting unit for correcting the film thickness data within the effective range identified by the identifying unit. |
| 地址 |
Tokyo JP |
