SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To inhibit separation of a conductive member and generation of cracks.SOLUTION: A semiconductor device comprises: a substrate; a semiconductor element provided on the substrate; a plurality of electrodes which are provided on the substrate at a distance from each other and arranged so as to surround the semiconductor element in plan view; a first metallic member which covers the semiconductor element; a plurality of second metallic members which are formed on the first metallic member at a distance from each other and arranged on a part inside an outer peripheral part of the first metallic member in plan view; and a conductive member which is provided between the plurality of electrodes and the plurality of second metallic members arranged on positions opposite to the plurality of electrodes and bonded to the plurality of electrodes and the plurality of second metallic members.SELECTED DRAWING: Figure 7