| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board capable of obtaining a conductive pattern excellent in the peeling of a resist pattern, and in the accuracy of shape, and to provide a printed wiring board.SOLUTION: A method of manufacturing a printed wiring board for laminating a conductive pattern on at least one side of an insulating base film by a semi-additive method includes a step of heating a resist pattern laminated on at least one side of the base film. Preferably, a conductive pattern is also laminated on the other side of the base film by a step similar to that used for the one side. Heating temperature in the heating step is preferably 100°C or higher and 200°C or lower. Heating time in the heating step is preferably 5 minutes or more and 60 minutes or less.SELECTED DRAWING: Figure 1C |
