发明名称 LASER BEAM APPARATUS FOR MATERIAL PROCESSING
摘要 PROBLEM TO BE SOLVED: To provide a laser beam apparatus for material processing, capable of highly accurate positioning while maintaining high in a response waveform quality.SOLUTION: A laser beam apparatus for material processing, comprises: a laser beam generation unit; a laser beam scan unit scanning a surface of a mounted workpiece two-dimensionally by the laser beam; a drive motor driving a scan mirror; a motor control circuit including a comparator and an integrator connected in parallel to each other and transmitting a control signal to the drive motor; an angle detector feeding back an angle detection signal of the scan mirror to the motor control circuit; and a laser beam control unit performing laser processing of a processing pattern on the workpiece. The motor control circuit generates an original deviation signal based on a target position signal and the angle detection signal, generates a non-uniform deviation signal on the basis of the original deviation signal so as to input non-uniform signals to the comparator and the integrator, adds an output from the comparator to which the non-uniform deviation signal is input to an output from the integrator to which the original deviation signal is input, and outputs the control signal to the drive motor.SELECTED DRAWING: Figure 8
申请公布号 JP2016034655(A) 申请公布日期 2016.03.17
申请号 JP20140157982 申请日期 2014.08.01
申请人 KEYENCE CORP 发明人 SUZUKI TAKEYUKI
分类号 B23K26/082;B23K26/00;B23K26/046 主分类号 B23K26/082
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