CURABLE SILICONE COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

A heat-curable silicone composition which includes a titanium oxide powder having an average particle diameter of 0.05-10 μm and an inorganic powder that is not titanium oxide and has an average particle diameter of 0.1-20 μm, the content of the titanium oxide powder being 50-90 mass% relative to the composition and the content of the inorganic powder being 5-40 mass% relative to the composition, characterized in that the surfaces of the titanium oxide powder and of the inorganic powder have been treated with a specific organosilane and/or a specific organosiloxane. The curable silicone composition is thixotropic, has satisfactory handleability and applicability, and cures to form a cured object which has a low coefficient of thermal expansion, a high hiding power, a high mechanical strength, and satisfactory adhesion to various substrates.