发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To prevent short-circuit between an upper electrode and a lower electrode even when cracks occur in a support insulating film, and to achieve a capacitor structure with a high resistance against stress.SOLUTION: After a capacitance insulating film and an upper electrode are sequentially formed on a lower electrode and a support insulating film, a protection insulating film is formed on the upper electrode. Thereafter, a part of the protection insulating film is removed by etching to expose a part of a surface of the upper electrode again. A plate electrode is laminated so as to cover the upper electrode completely.SELECTED DRAWING: Figure 15
申请公布号 JP2016035955(A) 申请公布日期 2016.03.17
申请号 JP20140157685 申请日期 2014.08.01
申请人 MICRON TECHNOLOGY INC 发明人 HIRATA KEI
分类号 H01L21/8242;H01L27/108 主分类号 H01L21/8242
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