| 发明名称 |
SEMICONDUCTOR PACKAGE ASSEMBLY |
| 摘要 |
The invention provides a semiconductor package, a semiconductor package assembly and a method for fabricating a semiconductor package. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die having first pads thereon. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. Conductive pillar structures are disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first RDL structure. |
| 申请公布号 |
US2016079205(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514932147 |
申请日期 |
2015.11.04 |
| 申请人 |
MediaTek Inc. |
发明人 |
LIN Tzu-Hung;PENG I-Hsuan;HSIAO Ching-Wen |
| 分类号 |
H01L25/065;H01L21/56;H01L21/48;H01L23/498;H01L23/12 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package assembly, comprising:
a first semiconductor package, comprising:
a first semiconductor die having first pads thereon; anda first redistribution layer (RDL) structure coupled to the first semiconductor die; andconductive pillar structures disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first redistribution layer (RDL) structure. |
| 地址 |
Hsin-Chu TW |
