Package with UBM and Methods of Forming

摘要

Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes an integrated circuit die, an encapsulant at least laterally encapsulating the integrated circuit die, a redistribution structure on the integrated circuit die and the encapsulant, a connector support metallization coupled to the redistribution structure, and an external connector on the connector support metallization. The redistribution structure includes a dielectric layer disposed distally from the encapsulant and the integrated circuit die. The connector support metallization has a first portion on a surface of the dielectric layer and has a second portion extending in an opening through the dielectric layer. The first portion of the connector support metallization has a sloped sidewall extending in a direction away from the surface of the dielectric layer.

主权项

1. A package structure comprising:
an integrated circuit die; an encapsulant at least laterally encapsulating the integrated circuit die; a redistribution structure on the integrated circuit die and the encapsulant, the redistribution structure comprising a first dielectric layer disposed distally from the encapsulant and the integrated circuit die; a connector support metallization coupled to the redistribution structure, the connector support metallization having a first portion on a first surface of the first dielectric layer and having a second portion extending in an opening through the first dielectric layer, the first portion of the connector support metallization having a sloped sidewall extending in a direction away from the first surface of the first dielectric layer; and an external connector on the connector support metallization.