发明名称 PRECIPITATION HARDENED PARTIAL TRANSIENT LIQUID PHASE BOND
摘要 A precipitation-hardened partial transient liquid phase bond and method of making same is provided. The bond is created at a bonding temperature and then, based on the phase diagrams corresponding to the materials in the interlayer between the bonded materials, the bond is held at a lower heat-treatment temperature to achieve a precipitation-hardened structure.
申请公布号 US2016075119(A1) 申请公布日期 2016.03.17
申请号 US201414890328 申请日期 2014.02.27
申请人 United Technologies Corporation 发明人 Cook, III Grant O.
分类号 B32B37/06;C04B37/02;B32B7/04;B32B7/02;B32B37/14;B32B15/01 主分类号 B32B37/06
代理机构 代理人
主权项 1. A method of bonding a first material to a second material, the first material and second material defining a bonding region, the method comprising the steps of: placing a multi-layer interlayer of metallic materials between the first material and the second material to create an assembly, the interlayer having a thickness; heating the assembly to a bonding temperature to produce a liquid in the bonding region; holding the assembly at the bonding temperature for a suitable time until the liquid has isothermally solidified due to diffusion within the interlayer and until a sufficiently homogenized interlayer has been created; and precipitation hardening the interlayer by holding the interlayer at a hardening temperature lower than the bonding temperature for a specified period of time, thereby creating a precipitation-hardened PTLP bond.
地址 Hartford CT US