发明名称 |
PRECIPITATION HARDENED PARTIAL TRANSIENT LIQUID PHASE BOND |
摘要 |
A precipitation-hardened partial transient liquid phase bond and method of making same is provided. The bond is created at a bonding temperature and then, based on the phase diagrams corresponding to the materials in the interlayer between the bonded materials, the bond is held at a lower heat-treatment temperature to achieve a precipitation-hardened structure. |
申请公布号 |
US2016075119(A1) |
申请公布日期 |
2016.03.17 |
申请号 |
US201414890328 |
申请日期 |
2014.02.27 |
申请人 |
United Technologies Corporation |
发明人 |
Cook, III Grant O. |
分类号 |
B32B37/06;C04B37/02;B32B7/04;B32B7/02;B32B37/14;B32B15/01 |
主分类号 |
B32B37/06 |
代理机构 |
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代理人 |
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主权项 |
1. A method of bonding a first material to a second material, the first material and second material defining a bonding region, the method comprising the steps of:
placing a multi-layer interlayer of metallic materials between the first material and the second material to create an assembly, the interlayer having a thickness; heating the assembly to a bonding temperature to produce a liquid in the bonding region; holding the assembly at the bonding temperature for a suitable time until the liquid has isothermally solidified due to diffusion within the interlayer and until a sufficiently homogenized interlayer has been created; and precipitation hardening the interlayer by holding the interlayer at a hardening temperature lower than the bonding temperature for a specified period of time, thereby creating a precipitation-hardened PTLP bond. |
地址 |
Hartford CT US |