SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE

摘要

The present technology relates to a solid-state imaging element, imaging device, electronic device, and semiconductor device wherein a simple technique is employed such that underfill resin filled at areas where a substrate and a flip-chip are electrically connected can be prevented from spreading out and secondary damage due for example to electrical short-circuiting or contact with processing equipment can be prevented. A molding technique used for forming on-chip lenses is used to form a ring-like or rectangular dam surrounding an area of a lens material layer where a flip-chip is connected via solder bumps, said lens material layer being disposed on the top layer of a substrate of the solid-state imaging element in order to form on-chip lenses. Consequently, the underfill resin filled in the area where the substrate and the flip-chip are electrically connected together is confined therein. The present technique can be applied to a solid-state imaging element.