METHOD FOR MANUFACTURING STRUCTURE HAVING RECESSED PATTERN, RESIN COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE

摘要

The present invention relates to a method for manufacturing a structure having a recessed pattern, to a resin composition, to a method for forming an electroconductive film, to an electronic circuit, and to an electronic device, the method for manufacturing a structure having a recessed pattern including steps (i) and (ii), and the recessed pattern having a film thickness 5% to less than 90% of the film thickness of a coating film obtained in step (i). (i): A step for forming a coating film on a non-flat surface of a structure using a resin composition including an acid-generating agent and a polymer having an acid-dissociable group. (ii): A step for forming a recess by irradiation of a predetermined portion of a section of the coating film.