发明名称 |
FORMATION OF A I-III-VI2 SEMICONDUCTOR LAYER BY HEAT TREATMENT AND CHALCOGENIZATION OF AN I-III METALLIC PRECURSOR |
摘要 |
A process for forming a semiconductor layer, especially with a view to photovoltaic applications, and more particularly to a process for forming a semiconductor layer of I-III-VI2 type by heat treatment and chalcogenization of a metallic precursor of I-III type, the process comprising: a heating step under an inert atmosphere during which the temperature increases uniformly up to a first temperature of between 460° C. and 540° C., in order to enable the densification of the metallic precursor, and a chalcogenization step beginning at said first temperature and during which the temperature continues to increase up to a second temperature, a stabilization temperature, of between 550° C. and 600° C., in order to enable the formation of the semiconductor layer. The formation of a semiconductor layer, or equivalently of an absorber, having a gain in conversion efficiency of around 4%, is thus advantageously achieved. |
申请公布号 |
US2016079454(A1) |
申请公布日期 |
2016.03.17 |
申请号 |
US201414888786 |
申请日期 |
2014.04.30 |
申请人 |
NEXCIS |
发明人 |
Broussillou Cedric;Bodnar Sylvie |
分类号 |
H01L31/032;H01L21/677;F27D7/06;H01L31/036;F27B9/10;H01L31/18;H01L21/67 |
主分类号 |
H01L31/032 |
代理机构 |
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代理人 |
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主权项 |
1. A process for forming a type I-III-VI2 semiconductor layer by heat treatment and chalcogenization, in at least one chamber of a furnace, of a type I-III metal precursor deposited on a substrate, the process comprising:
a heating step under an inert atmosphere, during which the temperature uniformly increases to a first temperature of between 460° C. and 540° C., to enable densification of the metal precursor, and a chalcogenization step beginning at said first temperature and during which the temperature continues to increase to a second temperature, for stabilization, of between 550° C. and 600° C., to enable formation of the semiconductor layer. |
地址 |
Rousset FR |