METHODS TO CONTROL WAFER WARPAGE UPON COMPRESSION MOLDING THEREOF AND ARTICLES USEFUL THEREFOR

摘要

Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.

主权项

1. A multilayer structure comprising:
a silicon layer containing a plurality of chips on one face thereof and an underfill layer underneath said chips, a curable molding formulation applied to the same face as said plurality of chips, and a reinforcing element applied to said molding formulation, wherein the coefficient of thermal expansion (CTE) of the reinforcing element is sufficiently similar to the CTE of the silicon layer so as to minimize warping of said structure upon cure of said molding formulation.