| 发明名称 |
SEMICONDUCTOR DEVICE ARRANGEMENT AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE ARRANGEMENT |
| 摘要 |
A semiconductor device arrangement includes a semiconductor substrate which includes a semiconductor substrate front side and a semiconductor substrate back side. The semiconductor substrate includes at least one electrical element formed at the semiconductor substrate front side. The semiconductor device arrangement further includes at least one porous semiconductor region formed at the semiconductor substrate back side. |
| 申请公布号 |
US2016079183(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414484928 |
申请日期 |
2014.09.12 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Santos Rodriguez Francisco Javier |
| 分类号 |
H01L23/00;H01L21/66;H01L21/78;H01L29/06;H01L23/522 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device arrangement comprising:
a semiconductor substrate comprising a semiconductor substrate front side and a semiconductor substrate back side, wherein the semiconductor substrate comprises at least one electrical element formed at the semiconductor substrate front side; and a plurality of porous semiconductor regions formed at the semiconductor substrate back side. |
| 地址 |
Neubiberg DE |
