| 摘要 |
PROBLEM TO BE SOLVED: To simplify an individual piece manufacturing step including a step of mounting an individual piece on an object to be mounted without the need to re-hold a division surface side.SOLUTION: An individual piece manufacturing method comprises the steps of: preparing a wafer WF as a plate-like member (plate-like member preparing step); forming a groove 11 which does not penetrate a surface on the opposite side on both surfaces (one surface and the other surface) of the wafer WF (groove forming step); and forming a semiconductor chip CP as a plurality of individual pieces from the wafer WF by forming a notch 12 along one surface or the other surface from s side surface of the wafer WF (notch forming step).SELECTED DRAWING: Figure 4 |
