发明名称 COATED THERMALLY CONDUCTIVE PARTICLE, THERMALLY CONDUCTIVE JOINING MATERIAL AND JUNCTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide coated thermally conductive particles capable of effectively increasing heat dissipation property induced by the coated thermally conductive particles, in an article using the coated thermally conductive particles.SOLUTION: A coated thermally conductive particle 21 according to the present invention is used such that one side and other side of the coated thermally conductive particle 21 are brought into contact with a first metal plate and a second metal plate, respectively, between the first metal plate and the second metal plate. The coated thermally conductive particle 21 includes a base material particle 22 and a coating part 23 coating the surface 22a of the base material particle 22. The coating part 23 is formed of a thermally conductive material having a thermal conductivity of 20 W/m K or more, and the thermally conductive material is not metal.SELECTED DRAWING: Figure 1
申请公布号 JP2016036019(A) 申请公布日期 2016.03.17
申请号 JP20150144151 申请日期 2015.07.21
申请人 SEKISUI CHEM CO LTD 发明人 NAKATANI YASUHIRO;UENOYAMA SHINYA;MAENAKA HIROSHI
分类号 H01L23/373;C09J7/00;C09J11/04;C09J201/00;H01L23/36 主分类号 H01L23/373
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