| 主权项 |
1. An aqueous electrolytic composition useful in filling submicron features of a semiconductor integrated circuit device or through silicon vias, the composition comprising:
an acid; copper ions; and a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent corresponding to the formula: wherein: G is selected from the group consisting of a single covalent bond, —O—, O-((A)r-O)s— and -((A)r-O)s— A has the structure each of p and r is independently an integer between 1 and 6 inclusive, s is an integer between 1 and 10 inclusive, q is an integer between 0 and 6 inclusive; each of R1, R2, R3, R4, R5, R6 and R34 is independently selected from the group consisting of hydrogen and substituted or unsubstituted aliphatic hydrocarbyl comprising 1 to 4 carbon atoms, R33 is substituted or unsubstituted aliphatic hydrocarbyl having 1 to 4 carbon atoms, Y is a leaving group selected from the group consisting of chloride, bromide, iodide, tosyl, triflate, sulfonate, mesylate, methosulfate, fluorosulfonate, methyl tosylate, and brosylate, Z is selected from the group consisting of R30 and a leaving group independently selected from the same group as Y, and R30 is selected from the group consisting of aliphatic hydrocarbyl, and when -G- is other than a single covalent bond, q is at least one. |
