| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device that can seal an electronic component without breaking the electronic component irrespective of high injection pressure of sealing resin even under a condition that strong cramping cannot be applied, whereby the yield can be maintained.SOLUTION: A resin sealing device 10 has a hydraulic device 40 functioning as press means for pinching an electronic component D disposed in a cavity C formed by an upper mold 20 and a lower mold 30 between a movable block 32 formed in the lower mold 30 and the upper mold 20. The hydraulic device 40 has a hydraulic pump 41 for feeding hydraulic oil under pressure, a hydraulic piston 43 which supports the movable block 32 and applies pressure to the movable block 32 with the hydraulic oil from the hydraulic pump 41, and a hydraulic oil changeover valve 45 for cutting off the circuit of the hydraulic oil. When the electronic component D is pinched, the hydraulic changeover valve 45 stops flow of the hydraulic oil into the hydraulic piston 43 by cutting off the flow of the hydraulic oil, and prevents the movable block 32 from being thrust back by the pressure of sealing resin material.SELECTED DRAWING: Figure 1 |
