| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME |
| 摘要 |
A semiconductor package structure and a method of fabricating the same are provided. The semiconductor package structure includes a package body having opposing first and second surfaces; a plurality of first conductive pads and a plurality of second conductive pads formed on the first surface of the package body; a semiconductor component embedded in the package body and electrically connected to the first conductive pads; and a plurality of conductive elements embedded in the package body, each of the conductive elements having a first end electrically connected to a corresponding one of the second conductive pads and a second end opposing the first end and exposed from the second surface of the package body. Since the semiconductor component is embedded in the package body, the thickness of the semiconductor package structure is reduced. |
| 申请公布号 |
US2016079170(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514708249 |
申请日期 |
2015.05.10 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Pai Yu-Cheng;Hsiao Wei-Chung;Chiu Shih-Chao;Lin Chun-Hsien;Sun Ming-Chen;Shen Tzu-Chieh;Chen Chia-Cheng |
| 分类号 |
H01L23/538;H01L21/56;H01L21/48;H01L25/00;H01L23/00;H01L25/065 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a package body having opposing first and second surfaces; a plurality of first conductive pads and a plurality of second conductive pads formed on the first surface of the package body; a semiconductor component embedded in the package body and electrically connected to the first conductive pads; and a plurality of conductive elements embedded in the package body, each of the conductive elements having a first end electrically connected to a corresponding one of the second conductive pads and a second end opposing the first end and exposed from the second surface of the package body. |
| 地址 |
Taichung TW |
